MEMS Packaging Technologies and 3D Integration
Seok, Seonho (editor)
This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.
Keywordsheterogeneous integration; wafer bonding; wafer sealing; room-temperature bonding; Au-Au bonding; surface activated bonding; Au film thickness; surface roughness; microelectromechanical systems (MEMS) packaging; inkjet printing; redistribution layers; capacitive micromachined ultrasound transducers (CMUT); fan-out wafer-level packaging (FOWLP); adhesion; thin film metal; parylene; neural probe; scotch tape test; FEM; MEMS resonator; temperature coefficient; thermal stress; millimeter-wave; redundant TSV; equivalent circuit model; S-parameters extraction; technology evaluation; MEMS and IC integration; MCDM; fuzzy AHP; fuzzy VIKOR; fan-out wafer-level package; finite element; glass substrate; reliability life; packaging-on-packaging; thermal sensors; TMOS sensor; finite difference time domain; optical and electromagnetics simulations; finite element analysis; ultrasonic bonding; metal direct bonding; microsystem integration; biocompatible packaging; implantable; reliability; Finite element method (FEM); simulation; multilayer reactive bonding; integrated nanostructure-multilayer reactive system; spontaneous self-ignition; self-propagating exothermic reaction; Pd/Al reactive multilayer system; Ni/Al reactive multilayer system; low-temperature MEMS packaging; crack propagation; microbump; deflection angle; stress intensity factor (SIF); polymer packaging; neural interface; chronic implantation; n/a
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Publication date and place2022
Research & information: general
Biology, life sciences