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MEMS Packaging Technologies and 3D Integration

dc.contributor.editorSeok, Seonho
dc.date.accessioned2022-06-21T09:06:45Z
dc.date.available2022-06-21T09:06:45Z
dc.date.issued2022
dc.identifierONIX_20220621_9783036542584_10
dc.identifier.urihttps://directory.doabooks.org/handle/20.500.12854/84576
dc.description.abstractThis Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.
dc.languageEnglish
dc.subject.classificationthema EDItEUR::G Reference, Information and Interdisciplinary subjects::GP Research and information: generalen_US
dc.subject.classificationthema EDItEUR::P Mathematics and Science::PS Biology, life sciencesen_US
dc.subject.otherheterogeneous integration
dc.subject.otherwafer bonding
dc.subject.otherwafer sealing
dc.subject.otherroom-temperature bonding
dc.subject.otherAu-Au bonding
dc.subject.othersurface activated bonding
dc.subject.otherAu film thickness
dc.subject.othersurface roughness
dc.subject.othermicroelectromechanical systems (MEMS) packaging
dc.subject.otherinkjet printing
dc.subject.otherredistribution layers
dc.subject.othercapacitive micromachined ultrasound transducers (CMUT)
dc.subject.otherfan-out wafer-level packaging (FOWLP)
dc.subject.otheradhesion
dc.subject.otherthin film metal
dc.subject.otherparylene
dc.subject.otherneural probe
dc.subject.otherscotch tape test
dc.subject.otherFEM
dc.subject.otherMEMS resonator
dc.subject.othertemperature coefficient
dc.subject.otherthermal stress
dc.subject.othermillimeter-wave
dc.subject.otherredundant TSV
dc.subject.otherequivalent circuit model
dc.subject.otherS-parameters extraction
dc.subject.othertechnology evaluation
dc.subject.otherMEMS and IC integration
dc.subject.otherMCDM
dc.subject.otherfuzzy AHP
dc.subject.otherfuzzy VIKOR
dc.subject.otherfan-out wafer-level package
dc.subject.otherfinite element
dc.subject.otherglass substrate
dc.subject.otherreliability life
dc.subject.otherpackaging-on-packaging
dc.subject.otherthermal sensors
dc.subject.otherTMOS sensor
dc.subject.otherfinite difference time domain
dc.subject.otheroptical and electromagnetics simulations
dc.subject.otherfinite element analysis
dc.subject.otherultrasonic bonding
dc.subject.othermetal direct bonding
dc.subject.othermicrosystem integration
dc.subject.otherbiocompatible packaging
dc.subject.otherimplantable
dc.subject.otherreliability
dc.subject.otherFinite element method (FEM)
dc.subject.othersimulation
dc.subject.othermultilayer reactive bonding
dc.subject.otherintegrated nanostructure-multilayer reactive system
dc.subject.otherspontaneous self-ignition
dc.subject.otherself-propagating exothermic reaction
dc.subject.otherPd/Al reactive multilayer system
dc.subject.otherNi/Al reactive multilayer system
dc.subject.otherlow-temperature MEMS packaging
dc.subject.othercrack propagation
dc.subject.othermicrobump
dc.subject.otherdeflection angle
dc.subject.otherstress intensity factor (SIF)
dc.subject.otherpolymer packaging
dc.subject.otherneural interface
dc.subject.otherchronic implantation
dc.subject.othern/a
dc.titleMEMS Packaging Technologies and 3D Integration
dc.typebook
oapen.identifier.doi10.3390/books978-3-0365-4257-7
oapen.relation.isPublishedBy46cabcaa-dd94-4bfe-87b4-55023c1b36d0
oapen.relation.isbn9783036542584
oapen.relation.isbn9783036542577
oapen.pages210


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