Micro/Nano Structures and Systems : Analysis, Design, Manufacturing, and Reliability

doi:10.3390/books978-3-0365-6544-6

Download Url(s)

https://mdpi.com/books/pdfview/book/6680

Contributor(s)

Georgantzinos, Stelios K. (editor)

Language

English

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Abstract

Micro/Nano Structures and Systems: Analysis, Design, Manufacturing, and Reliability is a comprehensive guide that explores the various aspects of micro- and nanostructures and systems. From analysis and design to manufacturing and reliability, this reprint provides a thorough understanding of the latest methods and techniques used in the field. With an emphasis on modern computational and analytical methods and their integration with experimental techniques, this reprint is an invaluable resource for researchers and engineers working in the field of micro- and nanosystems, including micromachines, additive manufacturing at the microscale, micro/nano-electromechanical systems, and more. Written by leading experts in the field, this reprint offers a complete understanding of the physical and mechanical behavior of micro- and nanostructures, making it an essential reference for professionals in this field.

URI

https://directory.doabooks.org/handle/20.500.12854/96734

Keywords

deployable structure; compliant mechanism; bistable mechanism; programmable behaviour; 5G; mmWave; SIW; hybrid feeding; SIC; wide bandwidth; ECC; stable high gain; isolation; MEG; DIG; SAR; SSL; metamaterials (MMTs); DRAs; Fano resonance; SPPs; U-shaped ring resonator; sensor; metal-insulator-metal; micropump; magnetorheological; MRE; magneto-solid-fluid interaction; additive manufacturing; microscale; design; materials; processes; applications; atomic layer deposition; sacrificial templates; 3D nanostructures; EDM; SiCp/Al; recast layer; residual stress; solidification; deep-narrow groove; GH4169 alloy; electrochemical milling; wedged end face; micro automotive electronic pump; computational fluid dynamics; numerical simulation; experimental techniques; cavitation; thermodynamic effects; InP; SiC; flip-chip bonding; millimeter wave; heterogeneous integration; linear guide; decoupling mechanism; finite element analysis; micro-milling; wear; tool failure; coating; substrate; delamination; Fresnel zone plate; annular structure; femtosecond laser machining; concentric double-ring beams; MEMs; burn-in; quality; reliability; warranty; maintenance; optimization; degradation; material properties; test structures; stress gradients; thin-film material properties; micro- and nano-systems (MNS) fabrication and manufacturing; microstructures; nanostructures; mechanics; analysis