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Influence of strain on the functionality of ink-jet printed thin films and devices on flexible substrates

dc.contributor.authorMishra, Nilesha*
dc.date.accessioned2021-02-11T16:11:05Z
dc.date.available2021-02-11T16:11:05Z
dc.date.issued2019*
dc.date.submitted2019-07-30 20:02:00*
dc.identifier35069*
dc.identifier.issn21929963*
dc.identifier.urihttps://directory.doabooks.org/handle/20.500.12854/50197
dc.description.abstractInk-jet printed devices on the flexible substrate are inexpensive and large area compatible as compared to rigid substrates. However, during fabrication and service they are subjected to complex strains, resulting in crack formation or delamination within the layers, affecting the device performance. Therefore, it is necessary to understand their failure mechanisms by correlating their electrical or structural properties with applied strain, supported by detailed microstructural investigations.*
dc.languageEnglish*
dc.relation.ispartofseriesSchriftenreihe des Instituts für Angewandte Materialien, Karlsruher Institut für Technologie*
dc.subjectT1-995*
dc.subject.otherelektromechanische Charakterisierung*
dc.subject.otherflexible Elektronik*
dc.subject.otherthin-film devices*
dc.subject.otherInk-jet printing*
dc.subject.otherflexible electronics*
dc.subject.othersynchrotron X-ray diffraction*
dc.subject.otherDünnschichtbauteil*
dc.subject.otherInk-jet drucken*
dc.subject.otherSynchrotron-Röntgenbeugung*
dc.subject.otherelectro-mechanical characterization*
dc.titleInfluence of strain on the functionality of ink-jet printed thin films and devices on flexible substrates*
dc.typebook
oapen.identifier.doi10.5445/KSP/1000086125*
oapen.relation.isPublishedBy68fffc18-8f7b-44fa-ac7e-0b7d7d979bd2*
oapen.relation.isbn9783731508533*
oapen.pagesX, 127 p.*
oapen.volume77*


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