Influence of strain on the functionality of ink-jet printed thin films and devices on flexible substrates

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https://www.ksp.kit.edu/9783731508533
Author(s)
Mishra, Nilesha
Language
English
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Abstract
Ink-jet printed devices on the flexible substrate are inexpensive and large area compatible as compared to rigid substrates. However, during fabrication and service they are subjected to complex strains, resulting in crack formation or delamination within the layers, affecting the device performance. Therefore, it is necessary to understand their failure mechanisms by correlating their electrical or structural properties with applied strain, supported by detailed microstructural investigations.
URI
https://directory.doabooks.org/handle/20.500.12854/50197
Keywords
elektromechanische Charakterisierung; flexible Elektronik; thin-film devices; Ink-jet printing; flexible electronics; synchrotron X-ray diffraction; Dünnschichtbauteil; Ink-jet drucken; Synchrotron-Röntgenbeugung; electro-mechanical characterization
DOI
10.5445/KSP/1000086125
ISBN
9783731508533
Publisher
KIT Scientific Publishing
Publisher website
http://www.ksp.kit.edu/
Publication date and place
2019
Series
Schriftenreihe des Instituts für Angewandte Materialien, Karlsruher Institut für Technologie,
Classification
Technology: general issues
Pages
X, 127 p.
Review type
Full text
Anonymity
All identities known
Reviewer type
Editorial board member; External peer reviewer
Review stage
Pre-publication
Open review
No
Publish responsibility
Books or series editor
Rights
https://creativecommons.org/licenses/by-sa/4.0/
https://creativecommons.org/licenses/by-sa/4.0/
Except where otherwise noted, this item's license is described as https://creativecommons.org/licenses/by-sa/4.0/