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dc.contributor.editorCrovetti, Paolo Stefano
dc.date.accessioned2022-01-11T13:31:08Z
dc.date.available2022-01-11T13:31:08Z
dc.date.issued2021
dc.identifierONIX_20220111_9783036505008_144
dc.identifier.urihttps://directory.doabooks.org/handle/20.500.12854/76408
dc.description.abstractRecent progress in the fields of Electrical and Electronic Engineering has created new application scenarios and new Electromagnetic Compatibility (EMC) challenges, along with novel tools and methodologies to address them. This volume, which collects the contributions published in the “Electromagnetic Interference and Compatibility” Special Issue of MDPI Electronics, provides a vivid picture of current research trends and new developments in the rapidly evolving, broad area of EMC, including contributions on EMC issues in digital communications, power electronics, and analog integrated circuits and sensors, along with signal and power integrity and electromagnetic interference (EMI) suppression properties of materials.
dc.languageEnglish
dc.subject.classificationthema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issuesen_US
dc.subject.classificationthema EDItEUR::K Economics, Finance, Business and Management::KN Industry and industrial studies::KNB Energy industries and utilitiesen_US
dc.subject.otherelectromagnetic bandgap (EBG)
dc.subject.otherdual perforation (DP)
dc.subject.otherparallel-plate noise
dc.subject.otherpower delivery network (PDN)
dc.subject.otherprinted circuit board (PCB)
dc.subject.othermeander split
dc.subject.otherpower/ground plane
dc.subject.othercrosstalk
dc.subject.othersignal integrity
dc.subject.otherequivalent circuit
dc.subject.othercapacitive and magnetic coupling
dc.subject.otherhall-effect current sensors
dc.subject.othercommercial current sensor
dc.subject.otherelectromagnetic compatibility (EMC)
dc.subject.otherelectromagnetic interference (EMI)
dc.subject.otherdirect power injection (DPI) test
dc.subject.othertransverse-electromagnetic (TEM) test
dc.subject.otherbulk current injection (BCI) test
dc.subject.otherSpread Spectrum
dc.subject.otherDC–DC power converters
dc.subject.otherdigital communications
dc.subject.otherchannel capacity
dc.subject.otherresonant coupling
dc.subject.otherElectromagnetic Interferences
dc.subject.otherAmplifiers
dc.subject.otherCMOS integrated circuits
dc.subject.othersusceptibility of the output pin
dc.subject.otherelectromagnetic compatibility
dc.subject.otherpower electronics EMC
dc.subject.otherEMI mitigation techniques
dc.subject.otherEMI filter design and optimization
dc.subject.othercommon mode noise
dc.subject.otherEMI modeling
dc.subject.otherFourier series
dc.subject.otherimpedance balancing
dc.subject.otherresonant frequency
dc.subject.otherbattery management system (BMS)
dc.subject.otherLi-ion battery pack
dc.subject.otherelectric vehicles (EVs)
dc.subject.otherhybrid electric vehicles (HEVs)
dc.subject.otherIC-level EMC
dc.subject.othersusceptibility to electromagnetic interference (EMI)
dc.subject.otherdirect power injection (DPI)
dc.subject.otheranechoic chamber
dc.subject.otherpolyaniline
dc.subject.othergelatin
dc.subject.othercomposite
dc.subject.othermicrowave absorption
dc.subject.otherdielectric permittivity
dc.subject.otherelectrical conductivity
dc.subject.othershielding effectiveness
dc.subject.otherbiochar
dc.subject.othereco-friendly material
dc.subject.othercementitious composites
dc.subject.otherwaveguides
dc.subject.otherelectromagnetic interference (EMI) suppressors
dc.subject.othersleeve ferrite cores
dc.subject.othercable filtering
dc.subject.othernanocrystalline (NC)
dc.subject.othersplit-core
dc.subject.othersnap ferrite
dc.subject.othergap
dc.subject.otherDC currents
dc.subject.otherrelative permeability
dc.subject.otherimpedance
dc.subject.otherconducted emissions
dc.subject.otherDiscrete Wavelet Transform
dc.subject.otherelectromagnetic interference
dc.subject.otherEmpirical Mode Decomposition
dc.subject.otherharmonics
dc.subject.otherSwitched-Mode Power Supplies
dc.subject.othertransients
dc.subject.otherWavelet Packet Transform
dc.titleElectromagnetic Interference and Compatibility
dc.typebook
oapen.identifier.doi10.3390/books978-3-0365-0501-5
oapen.relation.isPublishedBy46cabcaa-dd94-4bfe-87b4-55023c1b36d0
oapen.relation.isbn9783036505008
oapen.relation.isbn9783036505015
oapen.pages206
oapen.place.publicationBasel, Switzerland


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