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dc.contributor.editorRencz, Márta
dc.contributor.editorCodecasa, Lorenzo
dc.contributor.editorPoppe, Andras
dc.date.accessioned2021-05-01T15:06:10Z
dc.date.available2021-05-01T15:06:10Z
dc.date.issued2021
dc.identifierONIX_20210501_9783039438310_27
dc.identifier.urihttps://directory.doabooks.org/handle/20.500.12854/68284
dc.description.abstractThis book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.
dc.languageEnglish
dc.subject.classificationthema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues::TBX History of engineering and technologyen_US
dc.subject.otherlithium-ion battery
dc.subject.otherthermal modelling
dc.subject.otherelectro-thermal model
dc.subject.otherheat generation
dc.subject.otherexperimental validation
dc.subject.otherthermal transient testing
dc.subject.othernon-destructive testing
dc.subject.otherthermal testability
dc.subject.otheraccuracy repeatability and reproducibility of thermal measurements
dc.subject.otherthermal testing standards
dc.subject.other3D IC
dc.subject.othermicrochannels
dc.subject.otherliquid cooling
dc.subject.othercompact thermal model
dc.subject.otherthermal simulation
dc.subject.otherhotspot
dc.subject.otherthermal-aware task scheduling
dc.subject.otherDVFS
dc.subject.otherstatistical analysis
dc.subject.otherelectronic packages
dc.subject.otherdetailed thermal model
dc.subject.otherJoint Electron Device Engineering Council (JEDEC) metrics
dc.subject.otherthermal impedance
dc.subject.otherAlGaN-GaN HEMT
dc.subject.otherTDTR
dc.subject.otherthermal conductivity
dc.subject.otherthermal interface resistance
dc.subject.othersize effect
dc.subject.otherphonon transport mechanisms
dc.subject.othernonlinear thermal model
dc.subject.otherSPICE
dc.subject.otherpulse transformer
dc.subject.otherthermal phenomena
dc.subject.otherself-heating
dc.subject.othermodelling
dc.subject.othermeasurements
dc.subject.otherBCI-DCTM
dc.subject.otherROM
dc.subject.othermodal approach
dc.subject.otherBGA
dc.subject.othermodule temperature
dc.subject.othersolar energy
dc.subject.otherheat transfer mechanisms
dc.subject.otherpower LED measurement and simulation
dc.subject.otherlife testing
dc.subject.otherreliability testing
dc.subject.otherLM-80
dc.subject.otherTM-21
dc.subject.otherLED lifetime modelling
dc.subject.otherLED multi-domain modelling
dc.subject.otherSpice-like modelling of LEDs
dc.subject.otherlifetime extrapolation and modelling of LEDs
dc.subject.otherbeyond CMOS
dc.subject.otherVO2
dc.subject.otherthermal-electronic circuits
dc.subject.otherelectro-thermal simulation
dc.subject.othervertical structure
dc.subject.otherpower LEDs
dc.subject.otherthermal pads
dc.subject.otherthermal resistance
dc.subject.otheroptical efficiency
dc.subject.otherelectronics cooling
dc.subject.otherLight-emitting diodes
dc.subject.otherCoB LEDs
dc.subject.othermulti-domain modeling
dc.subject.otherfinite volume method
dc.subject.otherphosphor modeling
dc.subject.othermagnetic nanoparticle
dc.subject.othermicrofluidics
dc.subject.otherCFD
dc.subject.otherOpenFOAM
dc.subject.othertwo-phase solver
dc.subject.otherrheology
dc.subject.otherLED
dc.subject.otherDelphi4LED
dc.subject.otherdigital twin
dc.subject.otherdigital luminaire design
dc.subject.othercomputation time
dc.subject.otherIndustry 4.0
dc.titleThermal and Electro-thermal System Simulation 2020
dc.typebook
oapen.identifier.doi10.3390/books978-3-03943-832-7
oapen.relation.isPublishedBy46cabcaa-dd94-4bfe-87b4-55023c1b36d0
oapen.relation.isbn9783039438310
oapen.relation.isbn9783039438327
oapen.pages310
oapen.place.publicationBasel, Switzerland


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