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dc.contributor.editorHuang, Zheng-Ming
dc.contributor.editorHemeda, Sayed
dc.date.accessioned2021-04-20T16:05:08Z
dc.date.available2021-04-20T16:05:08Z
dc.date.issued2019
dc.identifierONIX_20210420_9781839682544_2524
dc.identifier.urihttps://directory.doabooks.org/handle/20.500.12854/67165
dc.description.abstractThis book, Failure Analysis, covers a broadest sense failure to a narrowest sense one. One purpose of this book is to provide the reader with an overall picture of various failures and how to deal with them. Another purpose is to present the latest scientific advancements in this field. For instance, an innovative concept of true stresses is introduced and is shown to be necessary in dealing with a composite failure micromechanically.
dc.languageEnglish
dc.subject.classificationthema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TJ Electronics and communications engineering::TJK Communications engineering / telecommunications::TJKT Telephone technology::TJKT1 Mobile phone technologyen_US
dc.subject.otherStructural engineering
dc.titleFailure Analysis
dc.typebook
oapen.identifier.doi10.5772/intechopen.75250
oapen.relation.isPublishedBy78a36484-2c0c-47cb-ad67-2b9f5cd4a8f6
oapen.relation.isbn9781839682544
oapen.relation.isbn9781839682537
oapen.relation.isbn9781839682551
oapen.imprintIntechOpen
oapen.pages178


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