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dc.contributor.editorZhao, Wensheng
dc.date.accessioned2023-04-05T12:52:01Z
dc.date.available2023-04-05T12:52:01Z
dc.date.issued2023
dc.identifierONIX_20230405_9783036567334_84
dc.identifier.urihttps://directory.doabooks.org/handle/20.500.12854/98805
dc.description.abstractUnlike transistors, the continuous downscaling of feature size in CMOS technology leads to a dramatic rise in interconnect resistivity and concomitant performance degradation. At nanoscale technology nodes, interconnect delay and reliability become the major bottlenecks faced by modern integrated circuits. To resolve these interconnect problems, various emerging technologies, including airgap, nanocarbon, optical, and through-silicon via (TSV), have been proposed and investigated. For example, by virtue of TSV technology, dies can be stacked to increase the integration density. More importantly, 3D integration and packaging also offer the most promising platform to implement "More-than-Moore" technologies, providing heterogeneous materials and technologies on a single chip. The "Advanced Interconnect and Packaging" Special Issue seeks to showcase research papers on new developments in advanced interconnect and packaging, i.e., on the design, modeling, fabrication, and reliability assessment of emerging interconnect and packaging technologies. Additionally, there are two interesting papers on carbon nanotube interconnects and interconnect reliability issues.
dc.languageEnglish
dc.subject.classificationthema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issuesen_US
dc.subject.classificationthema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues::TBX History of engineering and technologyen_US
dc.subject.otherantenna current
dc.subject.othertransmission line model
dc.subject.otherfrequency-selective surface analytical approximation
dc.subject.otherlow-temperature soldering
dc.subject.other3D IC
dc.subject.otherBi aggregation
dc.subject.otherSn-Bi solder
dc.subject.otherintegrated circuit interconnects
dc.subject.otheraging
dc.subject.otherreliability
dc.subject.otherelectromigration
dc.subject.otherphysics-based modeling
dc.subject.otheraverage power handling capability (APHC)
dc.subject.otherslow-wave transmission line (SWTL)
dc.subject.otherthermal resistance
dc.subject.otheraverage heat-spreading width
dc.subject.othertemperature-dependent resistivity
dc.subject.otherbroadside structure
dc.subject.otherfar-end crosstalk
dc.subject.otherimpedance
dc.subject.otherinterposer channel
dc.subject.othersilicon interposer
dc.subject.othervertical tabbed via
dc.subject.otheron-chip interconnect
dc.subject.othercarbon nanotube
dc.subject.otherthrough-silicon-via (TSV)
dc.subject.otherCu-CNT composite
dc.subject.otherCu–Sn bonding
dc.subject.otherAu–Au bonding
dc.subject.othergraphene
dc.subject.otherhigh-temperature pressure sensor
dc.subject.othersubstrate integrated waveguide (SIW)
dc.subject.otherspoof surface plasmon polaritons (SSPPs)
dc.subject.otherintegrated passive device
dc.subject.otherthrough-dielectric capacitor (TDC)
dc.subject.otherelectromagnetic bandgap (EBG)
dc.subject.otherinterposers
dc.subject.otherlow-loss substrates
dc.subject.othernoise suppression structures
dc.subject.otherpackages
dc.subject.otherpower delivery network (PDN)
dc.subject.otherpower/ground noise
dc.subject.otherPt–Pt interconnection
dc.subject.otherhigh-temperature resistant packaging
dc.subject.othermetallic bonding
dc.subject.otherAu wire bonding
dc.subject.otherhigh-temperature annealing
dc.subject.otherfocused ion beam (FIB)
dc.subject.othermorphology analysis
dc.subject.otherwettability
dc.subject.otherhot-melt glass
dc.subject.otherflow time
dc.subject.othercoverage thickness
dc.subject.otherSiO2 and Au substrate
dc.subject.otherMEMS sensor
dc.subject.otherreliability evaluation
dc.subject.othervacuum degradation
dc.subject.othermathematical model
dc.subject.otherparylene
dc.subject.otherblood oxygen
dc.subject.othersensing array
dc.subject.otherwearable device
dc.subject.otheron-chip spiral inductor
dc.subject.othercircuit model
dc.subject.otherkinetic inductance
dc.subject.otherquantum resistance
dc.subject.otherfrequency selective rasorber (FSR)
dc.subject.otherspoof surface plasmon polaritons (SSPP)
dc.subject.otherfrequency selective surface (FSS)
dc.subject.otherbroadband
dc.subject.otherdual active bridge
dc.subject.otherdeadbeat controller
dc.subject.otherload feedforward
dc.subject.othern/a
dc.titleAdvanced Interconnect and Packaging
dc.typebook
oapen.identifier.doi10.3390/books978-3-0365-6732-7
oapen.relation.isPublishedBy46cabcaa-dd94-4bfe-87b4-55023c1b36d0
oapen.relation.isbn9783036567334
oapen.relation.isbn9783036567327
oapen.pages266
oapen.place.publicationBasel


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