Advances in Sensors and Sensing for Technical Condition Assessment and NDT
Download Url(s)
https://mdpi.com/books/pdfview/book/4778Contributor(s)
Boczar, Tomasz (editor)
Kunicki, Michał (editor)
Wotzka, Daria (editor)
Nagi, Łukasz (editor)
Kozioł, Michał (editor)
Language
EnglishAbstract
The adequate assessment of key apparatus conditions is a hot topic in all branches of industry. Various online and offline diagnostic methods are widely applied to provide early detections of any abnormality in exploitation. Furthermore, different sensors may also be applied to capture selected physical quantities that may be used to indicate the type of potential fault. The essential steps of the signal analysis regarding the technical condition assessment process may be listed as: signal measurement (using relevant sensors), processing, modelling, and classification. In the Special Issue entitled “Advances in Sensors and Sensing for Technical Condition Assessment and NDT”, we present the latest research in various areas of technology.
Keywords
pulse compression; scattering; attenuation; insulation; ultrasonic testing; OLTC; AE sensor; acoustic emission; feature extraction; supervised classification; machine learning; contrast-enhanced ultrasound; muscle perfusion; Nakagami parameter; compounding Nakagami imaging; low-frequency sensor; power transformer; low-frequency noise; genetic algorithm; geometric layout of railway track; track axis identification; tramway loop; route’s polygon; GNSS mobile measurements; vibroarthography; VAG; knee joint; spectral features; frequency analysis; non-invasive examination; lateral temperature gradient; temperature field; boundary conditions; solar radiation intensity; temperature monitoring; non-destructive evaluation; eddy current; 3D sensing; inverse problem; wavelet transform; principal component analysis; neural network; incubation; spectrum; image processing; ROC curve; infrasound measurement system; wind turbine; infrasound correlation analysis; measuring scale; thermoelastic deformation; coefficient of thermal expansion; elastic waves; laser ultrasound; Fizeau fiber interferometer; defect identification; high-current pulses; current measurement; high-current shunts; circuit modeling; Rogowski coil; electrodynamic accelerators; n/aWebshop link
https://mdpi.com/books/pdfview ...ISBN
9783036526799, 9783036526782Publisher website
www.mdpi.com/booksPublication date and place
Basel, Switzerland, 2021Classification
Technology: general issues