Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces
Abstract
To create photonic multi-chip modules, integrated photonic chips need to be connected internally and to external glass fibers. A novel approach to address this task is the concept of photonic wire bonding, where free-standing polymer waveguides are printed in-situ by two-photon polymerization. This book contains a detailed description of the methodology of photonic wire bonding together with a number of key experiments.
Keywords
optische Aufbau- und Verbindungstechnik; Photonic Wire Bonding; optical interconnects; photonic integrated circuits; integrierte Photonik; Silizium-Photonik; silicon photonics; photonic wire bondingISBN
9783731507468Publisher
KIT Scientific PublishingPublisher website
http://www.ksp.kit.edu/Publication date and place
2018Series
Karlsruhe Series in Photonics and Communications / Karlsruhe Institute of Technology, Institute of Photonics and Quantum Electronics (IPQ),Classification
Technology: general issues