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MEMS/NEMS Sensors: Fabrication and Application

dc.contributor.authorKoley, Goutam*
dc.contributor.authorJahangir, Ifat*
dc.date.accessioned2021-02-11T19:15:26Z
dc.date.available2021-02-11T19:15:26Z
dc.date.issued2019*
dc.date.submitted2019-12-09 16:10:12*
dc.identifier42715*
dc.identifier.urihttps://directory.doabooks.org/handle/20.500.12854/53149
dc.description.abstractDue to the ever-expanding applications of micro/nano-electromechanical systems (NEMS/MEMS) as sensors and actuators, interest in their development has rapidly expanded over the past decade. Encompassing various excitation and readout schemes, the MEMS/NEMS devices transduce physical parameter changes, such as temperature, mass or stress, caused by changes in desired measurands, to electrical signals that can be further processed. Some common examples of NEMS/MEMS sensors include pressure sensors, accelerometers, magnetic field sensors, microphones, radiation sensors, and particulate matter sensors. Despite a long history of development, fabrication of novel MEMS/NEMS devices still poses unique challenges due to their requirement for a suspended geometry; and many new fabrication techniques have been proposed to overcome these challenges. However, further development of these techniques is still necessary, as newer materials such as compound semiconductors, and 2-dimensional materials are finding their way in various MEMS/NEMS applications, with more complex structures and potentially smaller dimensions.*
dc.languageEnglish*
dc.subjectTA1-2040*
dc.subjectT1-995*
dc.subject.classificationthema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TB Technology: general issues::TBX History of engineering and technologyen_US
dc.subject.othervibrating ring gyroscope*
dc.subject.othern/a*
dc.subject.othertunnel magnetoresistive effect*
dc.subject.otheroptical sensor*
dc.subject.othermicro-NIR spectrometer*
dc.subject.otherpulse inertia force*
dc.subject.othergas sensor*
dc.subject.otherwet etching*
dc.subject.otheroil detection*
dc.subject.otherglass welding*
dc.subject.otherspring design*
dc.subject.otherpower consumption*
dc.subject.otherMEMS (micro-electro-mechanical system)*
dc.subject.otherback cavity*
dc.subject.otherdeflection position detector*
dc.subject.othermagnetic*
dc.subject.otherMEMS*
dc.subject.othersingle-layer SiO2*
dc.subject.otherfrequency tuning*
dc.subject.otherthreshold accuracy*
dc.subject.othersuspended micro hotplate*
dc.subject.otherAlGaN/GaN circular HFETs*
dc.subject.otherquadrature modulation signal*
dc.subject.otherinertial switch*
dc.subject.othernanoparticle sensor*
dc.subject.otherlow noise*
dc.subject.otherphotonic crystal nanobeam cavity*
dc.subject.otherfloating slug*
dc.subject.otherinfrared image*
dc.subject.otherbackstepping approach*
dc.subject.othermicrodroplet*
dc.subject.otheracceleration switch*
dc.subject.othermicrogyroscope*
dc.subject.othertemperature uniformity*
dc.subject.othermethane*
dc.subject.othermicrofluidic*
dc.subject.otheraccelerometer design*
dc.subject.otherphotonic crystal cavity*
dc.subject.otheranisotropy*
dc.subject.otherresonant frequency*
dc.subject.otherdual-mass MEMS gyroscope*
dc.subject.otheranalytical model*
dc.subject.othersingle crystal silicon*
dc.subject.othertemperature sensor*
dc.subject.othermicro fluidic*
dc.subject.otherrefractive index sensor*
dc.subject.othermicrowave measurement*
dc.subject.otherlow zero-g offset*
dc.subject.otherfemtosecond laser*
dc.subject.othermicropellistor*
dc.subject.otherrapid fabrication*
dc.subject.otheraccelerometer*
dc.subject.othertracking performance*
dc.subject.otherGaN diaphragm*
dc.subject.othermicroactuator*
dc.subject.otherresistance parameter*
dc.subject.otheroptomechanical sensor*
dc.subject.otherscanning grating mirror*
dc.subject.otherGaAs MMIC*
dc.subject.otheradaptive control*
dc.subject.otherfrequency split*
dc.subject.otherfrequency mismatch*
dc.subject.otherelectrostatic force feedback*
dc.subject.otherthermoelectric power sensor*
dc.subject.othersqueeze-film damping*
dc.subject.othersilicon*
dc.subject.otherwideband*
dc.subject.otherAccelerometer readout*
dc.subject.otherbonding strength*
dc.subject.otherhigh temperature pressure sensors*
dc.subject.other3D simulation*
dc.subject.otherlevel-set method*
dc.subject.othertetramethylammonium hydroxide (TMAH)*
dc.titleMEMS/NEMS Sensors: Fabrication and Application*
dc.typebook
oapen.identifier.doi10.3390/books978-3-03921-635-2*
oapen.relation.isPublishedBy46cabcaa-dd94-4bfe-87b4-55023c1b36d0*
oapen.relation.isbn9783039216352*
oapen.relation.isbn9783039216345*
oapen.pages242*
oapen.edition1st*


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