Export citation

Show simple item record

dc.contributor.authorMeier, Tobias*
dc.date.accessioned2021-02-11T18:33:11Z
dc.date.available2021-02-11T18:33:11Z
dc.date.issued2014*
dc.date.submitted2019-07-30 20:01:59*
dc.identifier34737*
dc.identifier.issn18695183*
dc.identifier.urihttps://directory.doabooks.org/handle/20.500.12854/52580
dc.description.abstractThis work presents approaches to extend limits of scanning probe microscopy techniques towards more versatile instruments using integrated sensor concepts. For structural surface analysis, magnetoresistive sensing is introduced and thermoresistive sensing is applied to study nanoscale phonon transport in chain-like molecules. Investigating with these techniques the properties of shape memory polymers, a fabrication method to design application-inspired micro- and nanostructures is introduced.*
dc.languageEnglish*
dc.relation.ispartofseriesSchriften des Instituts für Mikrostrukturtechnik am Karlsruher Institut für Technologie / Hrsg.: Institut für Mikrostrukturtechnik*
dc.subjectT1-995*
dc.subject.otherFormgedächtnis*
dc.subject.otherMagnetoresistive*
dc.subject.otherThermoresistive*
dc.subject.otherLeitfähigkeit*
dc.subject.otherMagnetismus*
dc.subject.otherTunnelwiderstandScanning Probe Microscopy*
dc.subject.otherRasterkraftmikroskopie*
dc.titleMagnetoresistive and Thermoresistive Scanning Probe Microscopy with Applications in Micro- and Nanotechnology*
dc.typebook
oapen.identifier.doi10.5445/KSP/1000042497*
oapen.relation.isPublishedBy68fffc18-8f7b-44fa-ac7e-0b7d7d979bd2*
virtual.oapen_relation_isPublishedBy.publisher_nameKIT Scientific Publishing
virtual.oapen_relation_isPublishedBy.publisher_websitehttp://www.ksp.kit.edu/
oapen.relation.isbn9783731502531*
oapen.pagesXI, 164 p.*
oapen.volume25*


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following Collection(s)

Show simple item record

https://creativecommons.org/licenses/by-sa/4.0/
Except where otherwise noted, this item's license is described as https://creativecommons.org/licenses/by-sa/4.0/