TY  - BOOK
AU  - Lindenmann, Nicole
AB  - To create photonic multi-chip modules, integrated photonic chips need to be connected internally and to external glass fibers. A novel approach to address this task is the concept of photonic wire bonding, where free-standing polymer waveguides are printed in-situ by two-photon polymerization. This book contains a detailed description of the methodology of photonic wire bonding together with a number of key experiments.
DO  - 10.5445/KSP/1000077963
ID  - OAPEN ID: 34202
KW  - optische Aufbau- und Verbindungstechnik
KW  - Photonic Wire Bonding
KW  - optical interconnects
KW  - photonic integrated circuits
KW  - integrierte Photonik
KW  - Silizium-Photonik
KW  - silicon photonics
KW  - photonic wire bonding
L1  - https://www.ksp.kit.edu/9783731507468
LA  - English
LK  - https://directory.doabooks.org/handle/20.500.12854/56210
PB  - KIT Scientific Publishing
PY  - 2018
SN  - 9783731507468
TI  - Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfacesnull
ER  - 
