TY  - BOOK
AU  - Burger, Sofie
AB  - In the last two decades, the reliability of small electronic devices used in automotive or consumer electronics gained researchers attention. Thus, there is the need to understand the fatigue properties and damage mechanisms of thin films. In this thesis a novel high-throughput testing method for thin films on Si substrate is presented. The specialty of this method is to test one sample at different strain amplitudes at the same time and measure an entire lifetime curve with only one experiment.
DO  - 10.5445/KSP/1000034759
ID  - OAPEN ID: 35355
KW  - damage structure
KW  - Fatigue
KW  - thin film
KW  - cantilever bending
L1  - https://www.ksp.kit.edu/9783731500254
LA  - English
LK  - https://directory.doabooks.org/handle/20.500.12854/49267
PB  - KIT Scientific Publishing
PY  - 2013
SN  - 9783731500254
TI  - High Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Methodnull
ER  - 
